GaN Template Grow Application Ssp Sapphire Carrier Substrate Chip

GaN Template Grow Application SSP Sapphire Carrier Substrate Chip 1. What is templatesWe use the term "template" to describe our products as they are different to substrates. Specifically, a template is a composite or engineered substrate, where one or more layers are added to the original susbstrate.2.Application

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GaN Template Grow Application SSP Sapphire Carrier Substrate Chip 


1. What is templates
We use the term "template" to describe our products as they are different to substrates. Specifically, a template is a composite or engineered substrate, where one or more layers are added to the original susbstrate.

2.Application
 
Blue and white LED for room lightings, displays and general use

GaN power switching devices

3.Product available

2" to 4" GaN-templates on FSS and PSS
Thick GaN-templates (t=3~20μm)
GaN-template with highly doped n-type layer (n=<1e19/cm3)
Ntype (undoped), Ntype (Si doped), and Ptype(Mg doped) templates are available
GaN Templates on both sapphire substres and Silicon substrates

4. Features
XRD-FWHM002102
3-4μGaN/Sapphire200-300250-450
GaN Template Grow Application Ssp Sapphire Carrier Substrate Chip

 Dislocation density:3.5E+08 cm-2



5. Specification
2inch specification
ItemGaN-FS-C-U-C50GaN-FS-C-N-C50GaN-FS-C-SI-C50
DimensionsФ 50.8 mm ± 1 mm
Thickness350 ± 25 µm
Useable Surface Area> 90%
OrientationC-plane (0001) off angle toward M-Axis 0.35°± 0.15°
Orientation Flat(1-100) ± 0.5°, 16.0 ± 1.0 mm
Secondary Orientation Flat(11-20) ± 3°, 8.0 ± 1.0 mm
Total Thickness Variation≤ 15 µm
BOW≤ 20 µm
Conduction TypeN-type
(Undoped)
N-type
(Ge-doped)
Semi-Insulating
(Fe-doped)
Resistivity(300K)< 0.5 Ω·cm< 0.05 Ω·cm>106 Ω·cm
Dislocation Density1~9x105 cm-25x105 cm-2
~3x106 cm-2
1~9x105 cm-2
1~3x106 cm-21~3x106 cm-2
PolishingFront Surface: Ra < 0.2 nm. Epi-ready polished
Back Surface: Fine ground
PackagePackaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

4inch specification
ItemGaN-T-C-U-C100GaN-T-C-N-C100
DimensionsФ 100 mm ± 0.1 mm
Thickness4 µm, 20 µm
OrientationC-plane(0001) ± 0.5°
Conduction TypeN-type
(Undoped)
N-type
(Si-doped)
Resistivity 300K< 0.5 Ω·cm< 0.05 Ω·cm
Carrier Concentration< 5x1017 cm-3> 1x1018 cm-3
Mobility~ 300cm2/V·s~ 200 cm2/V·s
Dislocation DensityLess than 5x108 cm-2
Substrate structureGaN on Sapphire(Standard: SSP Option: DSP)
Useable Surface Area> 90%
PackagePackaged in a class 100 clean room environment, in cassettes of 25pcs or single wafer containers, under a nitrogen atmosphere.

6. Product pictures
GaN Template Grow Application Ssp Sapphire Carrier Substrate Chip


GaN Template Grow Application Ssp Sapphire Carrier Substrate Chip

 

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